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Services Product Analysis

Product Analysis (PA) service includes tear-down and detailed examination of semiconductor device.

This analysis can be helpful for a customer in a different ways:

  • Compare competitor product with similar products within a customer products
  • Find the outstanding features of competitor product
  • Improve the competitive position on the market
  • Benchmark against future technology plans

REATISS provides several fundamental types (levels) of analytical reports to gain a wider understanding of the package and silicon processing techniques utilized by the competitive devices.

Report Demo
PA Level 0. This report gives a general understanding of what is inside the package, reveals the die image, and helps to determine the die manufacturer.

It serves for decision making regarding further analysis steps.

Report contents:
  • Package photos, marking
  • Package X-Ray
  • Photo of die at top metal level
  • Photo of die markings
  • Die and package dimensions
PA Level 1. This report provides results of PA Level 0 supplemented with a layout blocks measurement.

For this purposes the die is de-processed down to Metal1 or Diffusion level. The deliverables can be used for comparison with the customer own product and drawing conclusions regarding the die area utilization.

Report contents:
  • Package photos
  • Package X-Ray
  • Photo of die at top metal level
  • Package X-Ray and die combined image
  • Die and package dimensions
  • Photo of die markings
  • Photo of die at metal 1 / diffusion level
  • Boxing of the different blocks
  • Table account for the total die size per block (Flash, RAM, Analog blocks, Digital, Core area, total die)
Report Demo
PA Level 2. This is the most comprehensive technical examination of a competitor product.
Report helps to receive detailed information on various aspects as the blocks functionality, detailed area utilization measurements, and device technology analysis. Report includes several modules:
  • Technology analysis
    • # of metals, metallization materials
    • Vertical dimension measurements
    • Cross section images showing general device structure
    • Gate length measurements
  • Bond pads
    • Image of die fragment and bond pads
    • Bond pad blowup image
    • # of pads, pads bonded out
    • Pad measurements
  • Standard cell analysis
    • High-resolution top-down image in the sea of gates at M1 or poly
    • Standard cell size measurements
    • Cross section of MOS devices, gate length measurements
  • Functional analysis
    • Major functional block identification
    • Size measurements for major blocks
    • High resolution images of major blocks
  • Memory analysis (Flash, SRAM)
    • High-level structure
    • High-resolution top-down bit cell image at M1 or poly
    • Bit cell size measurements
    • Efficiency calculation
    • Flash cross section, feature size measurements
Report Demo
PA Level 3. This is a focused circuit extraction of the particular blocks.
Report contents:
  • Digital/analog schematics organized in a hierarchical manner (I/O Buffers, SRAM, FLASH, PLL, ADC, focused extraction of sea of gates etc.)
  • Signal tracing
  • Transistor-level details
  • Access to a high resolution layout image data base (focused areas/full die)
PA PCA. This report delivers detailed package construction analysis.

The results received through a package cross sections, material analysis, and physical dimension measurements. A customer may define particular areas of interest in order to perform benchmarking with own product in a most efficient way.

Standard report contents:
  • Package photos
  • Package X-Ray with construction dimensions.
  • Die top metal: die photo, dimensions, marking;
  • Bond pad photos with dimensions; wire measurements.
  • Inspect die edge for chipping/peeling.
  • Package cross-sections (through the leadframe, terminals, die): material analysis, construction detailed photos, measurements.

As a part of service, REATISS provides constant support and response to engineering requests for clarification of the data and additional information on a competitive die/package.