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Worlds first 3D Vertical NAND. Samsung K9HQGY8S5M / K9LPGY8S1M.

The package, process, architecture and circuit design of Snapdragon 805

Stacked Back-Illuminated sensor construction overview.

Layer-by-layer preparation and imaging of advanced LGA package.

Tri-gate technology detailed overview.

Advanced Process Analysis techniques overview(SEM, STEM, FIB).

MEMS structure and technology overview.

V-NAND construction detailed overview - Samsung K9HQGY8S5M / K9LPGY8S1M / K9ADGD8S0A.